Qualcomm unveiled the flagship Snapdragon 888 5G chipset earlier last month. It has been built on the 5nm process node and already powers devices like the Mi 11, Galaxy S21 series, and more. Now, Qualcomm is giving phone makers the arsenal to launch more affordable flagship phones in 2021. It has announced the Snapdragon 870 5G chipset today, which is essentially a minor upgrade over the Snapdragon 865.
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Snapdragon 870 Specifications
Qualcomm® Artificial Intelligence (AI) Engine
AIE GPU: Qualcomm® Adreno™ 650 GPU
AIE CPU: Qualcomm® Kryo™ 585 CPU
Hexagon Processor: Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Sensing Hub, Qualcomm® Hexagon™ 698 Processor
Cellular Modem
Modem Name: Qualcomm® Snapdragon™ X55 5G Modem-RF system
Performance Enhancement Technologies: Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ technology, Qualcomm® Signal Boost adaptive antenna tuning, Qualcomm® 5G PowerSave
5G Spectrum: Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz
5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
5G sub-6 GHz specs: 200 MHz bandwidth, 4×4 MIMO
Multi-SIM features: Global 5G multi-SIM
Cellular Technology: LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
5G Uplink Speed: Up to 3 Gbps
5G Downlink speed: Up to 7.5 Gbps
Wi-Fi
Wi-Fi Standards: Wi-Fi 6, Wi-Fi 5, 802.11a/b/g/n
Qualcomm® Wi-Fi 6 technology features: MU-MIMO (Uplink and Downlink), 8×8 sounding, OFDMA (Uplink and Downlink), 1024 QAM, Dual-band simultaneous (DBS), WPA3 security support, Target Wake Time
Wi-Fi Spectral Bands: 2.4GHz, 5GHz
Peak Speed: 1.774 Gbps
Bluetooth
Bluetooth Audio: Qualcomm® aptX™ Adaptive Audio, Qualcomm TrueWireless™ Technology, Bluetooth 5.2
Bluetooth Version: Bluetooth 5.2
NFC
Near Field Communications: Supported
Location
Satellite Systems Support: Beidou, Galileo, GLONASS, Dual-frequency GNSS, NavIC enabled, GPS, GNSS, QZSS, SBAS
USB
USB Version: USB 3.1, USB-C
CPU
CPU Clock Speed: Up to 3.2 GHz
CPU Cores: Qualcomm® Kryo™ 585 CPU, Octa-core CPU
CPU Architecture: 64-bit
Process
Process Technology: 7 nm
Qualcomm® FastConnect™ Subsystem
Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6800
Bluetooth Features: Qualcomm® TrueWireless™ Technology, Bluetooth 5.2, Qualcomm® aptX™ Adaptive Audio
Wi-Fi 6 features: MU-MIMO (Uplink and Downlink), 8×8 sounding, OFDMA (Uplink and Downlink), Dual-band simultaneous (DBS), WPA3 security support, Target Wake Time
Camera
Image Signal Processor: Qualcomm® Spectra™ 480 image signal processor, Hardware accelerator for computer vision (CV-ISP), Dual 14-bit CV-ISPs
Single Camera: Up to 200 MP
Camera Features: HEIF photo capture
Slow Motion Video Capture: 720p @ 960 FPS
Video Capture Formats: Dolby Vision, HDR10, HDR10+, HLG
Dual Camera, ZSL, 30fps: Up to 25 MP
Single Camera, MFNR, ZSL, 30fps: Up to 64 MP
Video Capture Features: 4K video capture with simultaneous 64MP photo capture, Rec. 2020 color gamut video capture, Up to 10-bit color depth video capture
Video
Codec Support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9
Display
Max On-Device Display: 4K @ 60 Hz, QHD+ @ 144 Hz
Max External Display: 4K @ 60 Hz
HDR: HDR10+, HDR10
Color Depth: Up to 10-bit
Color Gamut: Rec2020
General Audio
Audio Technology: Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8815, Qualcomm Aqstic™ audio technology
GPU
GPU Name: Qualcomm® Adreno™ 650 GPU
GPU Video Playback: Volumetric VR video playback, 8K 360 VR video playback
API Support: OpenCL™ 2.0 FP, Vulkan® 1.1, OpenGL® ES 3.2, DX12
Charging
Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 4+ technology
Security Support
Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max
Secure Processing Unit: Biometric Authentication (Fingerprint, Iris, Voice, Face)
Security Features: Camera Security, Crypto Engine, Key Provisioning Security, Malware Protection, Qualcomm® Content Protection, Qualcomm® Mobile Security, Qualcomm® Processor Security, Qualcomm® Trusted Execution Environment (TEE), Secure Boot, Secure Token
Memory
Memory speed: 2750MHz
Memory Type: 4x16bit, LPDDR5
Part
Part Number(s): SM8250-AC
Availability
“Building upon the success of Snapdragon 865 and 865+, the new Snapdragon 870 was designed to address OEM and mobile industry requirements,” mentioned Kedar Kondap, VP, product management, Qualcomm Technologies, Inc in the official blog post. Well-known OEM partners, including Motorola, iQOO, OnePlus, OPPO, and Xiaomi, will launch phones powered by this chipset in the first quarter of 2021.
The sole purpose behind the launch of the Snapdragon 870 is that phone makers will now be able to pitch their affordable flagships as powered by this year’s chipset. It enables them to get rid of the stigma attached with the use of last year’s Snapdragon 865/ 865+ on budget flagships in the sub-Rs. 35,000 price bracket in 2021.
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